Celestica DS6005: 102.4-Tbit/s Switch with CPO and Liquid Cooling

The company Celestica has introduced the DS6005, a high-performance switch designed for AI cluster infrastructures. The device delivers an aggregate switching capacity of 102.4 Tbit/s and utilizes Co-Packaged Optics (CPO) technology, which significantly shortens electrical signal paths and improves energy efficiency compared to traditional architectures.

CPO Architecture and Serviceability

As AI clusters scale, traditional switch architectures face physical limitations: transmitting electrical signals from the ASIC to external transceivers on the front panel increases power consumption and signal interference. The DS6005 addresses this by integrating optical engines in close proximity to the network chip. Powered by the Broadcom Tomahawk 6 Davisson ASIC, the switch provides 64 optical ports, each operating at 1.6 Tbit/s, resulting in a total capacity of 102.4 Tbit/s.

While CPO integration typically complicates maintenance, Celestica has implemented a solution using external, replaceable laser modules. This approach aims to maintain serviceability by allowing parts of the optical infrastructure to be swapped without replacing the entire switch unit.

Cooling and Form Factor

To manage the thermal output of the high-performance Broadcom chip and the dense optical components, the DS6005 features full liquid cooling. The unit is designed in a compact 1.5 OU form factor and adheres to the OCP Open Rack V3 standard. This high-density design is tailored for AI fabrics where minimizing latency and maximizing rack space efficiency are critical.

On the software side, the DS6005 supports the open-source SONiC network operating system, facilitating easier integration into existing automated management workflows. While Celestica has not yet released specific data regarding total power consumption or coolant requirements, the actual efficiency gains over conventional 102.4-Tbit/s switches remain to be verified through independent testing.