Xiaomi taps TSMC for 3nm XRing O3 chip with LPDDR6 to battle Qualcomm
Xiaomi has partnered with TSMC to develop the custom XRing O3 SoC, a 3nm mobile processor built on the N3P node featuring LPDDR6 memory support.
The chip utilizes a unique all-big-core architecture, abandoning efficiency cores in favor of ten high-performance units: two C1-Ultra cores up to 4.35GHz, four C1-Premium at 3.68GHz, and four C1-Pro reaching 3.15GHz. This design houses 24 billion transistors across a 133mm² die.
Benchmarks indicate performance in the ultra-flagship segment, with AnTuTu scores exceeding 5.2 million and Geekbench 6.5 multi-core results rivaling desktop-class silicon like Apple's M4. The integrated Mali-G2 Ultra NX GPU includes dedicated neural cores for frame generation and spatial upscaling.
Beyond mobile devices, Xiaomi has secured agreements with TSMC for the XRing O100 NPU and the XRing D100 automotive chip. The XRing O3 is scheduled to launch in the Xiaomi 18 Fold and Pad 9 Pro Max, with initial production volumes targeting 200,000 to 300,000 units.
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